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Electronic components information details information sheets today? The integration density of the current CPU is very high. The above functions are now integrated into the CPU and become a chip. For example, the K60 chip I am using now has these peripheral functions. The four chips of the early CPU peripherals are now integrated into one chip, so the current System is in one chip. That is, System on Chip (SoC), so theoretically there is a difference between CPU and SoC. The standard CPU refers to the early chips that only contain arithmetic units and controllers, and SoC has integrated the system into a whole chip. Therefore, the chips you buy now are all SoCs, and the standard CPUs are not too big to buy. Today’s CPUs have integrated many peripherals inside. Find extra details on pill tl001.
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The channel contention access principle of Wi-Fi. The core of Wi-Fi equipment access lies in carrier sense multiple access / collision avoidance (CSMA/CA). This mechanism of listening before speaking has been in use since the first generation of Wi-Fi (802.11) in 1997. However, there were few wireless network devices more than 20 years ago, and no one would consider the network congestion caused by competition when the number of devices increased. The real popularity of Wi-Fi began with Wi-Fi 4 (802.11n) in 2008. It can be said that since then, Wi-Fi has really become the most common form of Internet access for homes and businesses. The number of device models that support Wi-Fi has also increased exponentially.
Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors. Discover extra information on electronic hardware.
